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Grinding
CSP 1 - CSP 3

Grinding is necessary for removing weak thick latence to reach a sound substrate.

 

Grinding is the most effective method for rectifying and leveling uneven floors and removing construction debris/residue.

 

In addition, grinding using the right tools and techniques is ideal for removing all kinds of unwanted floor toppings and old coatings to reach a sound substrate.

 

SP has a fleet of industrial floor grinders, at all sizes and settings, to ensure our clients’ requirements are met and their satisfaction guaranteed.

How it works

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